2.3.1—Metallic bonding
- Syllabus
- First assessment 2025
- Objective
- 2.3.1
- Level
- SL
Metallic bonding is the electrostatic attraction between a lattice of positive metal ions and delocalized electrons.
Delocalized electrons can move through the structure and carry charge and thermal energy. Non-directional attraction allows layers of cations to slide while the bonding remains.
When a potential difference is applied, delocalized electrons drift through the fixed cation lattice and carry charge; the positive ions do not travel through the metal. When layers shift under force, non-directional attraction to the electron sea persists, explaining malleability rather than brittle fracture.
Property-to-use link: copper is used for electrical wiring because its delocalized electrons carry charge through the solid; aluminium can be rolled into foil because ion layers can shift while non-directional metallic attraction is maintained. A use must be justified by the relevant property, not merely by stating that the substance is a metal.
Representative question
Describe metallic bonding and how it contributes to electrical conductivity.
electrostatic attraction
between «a lattice of» cations/positive «metal» ions AND «a sea of» delocalized electrons
mobile electrons responsible for conductivity
OR
electrons move when a voltage/potential difference/electric field is applied
Marking guidance:
Do not accept "nuclei" for "cations/positive ions" in M2.
Accept "mobile/free" for "delocalized" electrons in M2.
Accept "electrons move when connected to a cell/battery/power supply" OR "electrons move when connected in a circuit" for M3.
Retrieve the model: positive ions attract delocalized electrons; electron mobility explains conductivity and non-directional bonding explains malleability; charge, radius, and d-electron contribution explain strength trends.
A complete property explanation should name the cation lattice, delocalized electrons, and the specific structural change relevant to the property.